世界頂級(jí)導(dǎo)熱膏：Arctic Silver 5，導(dǎo)熱膏中的愛馬仕。

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Introduction in English

Arctic Silver? 5
High-Density Polysynthetic Silver Thermal Compound   

With its unique high-density filling of micronized silver and enhanced thermally conductive ceramic particles, Arctic Silver 5 provides a new level of performance and stability. Available at Arctic Silver resellers worldwide. Arctic Silver 5 is the reference premium thermal compound. Arctic Silver 5 is optimized for a wide range of bond lines between modern high-power CPUs and high performance heatsinks or water-cooling solutions.   

Features:   

Made With 99.9% Pure Silver:
Arctic Silver 5 uses three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer.

High-Density:
Arctic Silver 5 contains over 88% thermally conductive filler by weight. In addition to micronized silver, Arctic Silver 5 also contains sub-micron zinc oxide, aluminum oxide and boron nitride particles. These thermally-enhanced ceramic particles improve the compound's performance and long-term stability   

Controlled Triple-Phase Viscosity:
Arctic Silver 5 does not contain any silicone. The suspension fluid is a proprietary mixture of advanced polysynthetic oils that work together to provide three distinctive functional phases. As it comes from the syringe, Arctic Silver 5's consistency is engineered for easy application. During the CPU's initial use, the compound thins out to enhance the filling of the microscopic valleys and ensure the best physical contact between the heatsink and the CPU core. Then the compound thickens slightly over the next 50 to 200 hours of use to its final consistency designed for long-term stability. (This should not be confused with conventional phase change pads that are pre-attached to many heatsinks. Those pads melt each time they get hot then re-solidify when they cool. The viscosity changes that Arctic Silver 5 goes through are much more subtle and ultimately much more effective.)

Not Electrically Conductive:
Arctic Silver 5 was formulated to conduct heat, not electricity.
(While much safer than electrically conductive silver and copper greases, Arctic Silver 5 should be kept away from electrical traces, pins, and leads. While it is not electrically conductive, the compound is very slightly capacitive and could potentially cause problems if it bridges two close-proximity electrical paths.)

Absolute Stability:
Arctic Silver 5 will not separate, run, migrate, or bleed.

Compliancy: RoHS2 Compliant.

Specifications:

Average Particle Size:
<0.49 micron <0.000020 inch

Extended Temperature Limits:
Peak: –50°C to >180°C
Long-Term: –50°C to 130°C

Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.

Coverage Area:
A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.       

Related Information:Arctic Silver 5 SDS:Safety Data SheetInstructions:How to apply thermal compoundFind an Authorized Reseller:USA | InternationalFind an Authorized Distributor:USA | International       

Important Reminder:
Due to the unique shape and sizes of the particles in Arctic Silver 5's conductive matrix, it will take a up to 200 hours and several thermal cycles to achieve maximum particle to particle thermal conduction and for the heatsink to CPU interface to reach maximum conductivity. (This period will be longer in a system without a fan on the heatsink or with a low speed fan on the heatsink.) On systems measuring actual internal core temperatures via the CPU's internal diode, the measured temperature will often drop 2C to 5C over this "break-in" period. This break-in will occur during the normal use of the computer as long as the computer is turned off from time to time and the interface is allowed to cool to room temperature. Once the break-in is complete, the computer can be left on if desired.

Caution:
We do not recommend using Arctic Silver 5 on the older slot type Intel Xeon processors with large multiple square inch CPU to heatsink interfaces. The huge contact area and large gaps between the processor and the heatsink require a thermal pad or thick mesh-reinforced paste. Arctic Silver 5 can be used on socket type Xeons without a problem.

中文介紹

北極銀? 5 高密度聚片雙銀熱復(fù)合

憑借其獨(dú)特的高密度微粉化銀填充和增強(qiáng)的導(dǎo)熱陶瓷顆粒，Arctic Silver 5提供了更高水平的性能和穩(wěn)定性。在全球的Arctic Silver轉(zhuǎn)售商處可用。北極銀5是參考優(yōu)質(zhì)導(dǎo)熱膠。Arctic Silver 5已針對(duì)現(xiàn)代大功率CPU和高性能散熱器或水冷解決方案之間的多種粘接線進(jìn)行了優(yōu)化。   

特征：  

由99.9％的純銀制成： 北極銀5使用三種獨(dú)特形狀和大小的純銀顆粒，以最大程度地增加顆粒間的接觸面積和熱傳遞。高密度：北極銀5包含超過88％重量的導(dǎo)熱填料。除了微粉化的銀之外，北極銀5還包含亞微米的氧化鋅，氧化鋁和氮化硼顆粒。這些熱增強(qiáng)的陶瓷顆粒改善了化合物的性能和長(zhǎng)期穩(wěn)定性

可控制的三相粘度：
北極銀5不含任何有機(jī)硅。懸浮液是高級(jí)多合成油的專有混合物，可共同提供三個(gè)獨(dú)特的功能相。由于來自注射器，Arctic Silver 5的稠度經(jīng)過精心設(shè)計(jì)，易于使用。在CPU的初次使用期間，該化合物會(huì)變薄，以增強(qiáng)微凹處的填充，并確保散熱器和CPU內(nèi)核之間的最佳物理接觸。然后，該化合物在接下來的50到200個(gè)小時(shí)的使用中會(huì)略微增稠，直至達(dá)到為長(zhǎng)期穩(wěn)定性而設(shè)計(jì)的最終稠度。 （這不應(yīng)與預(yù)先安裝在許多散熱器上的傳統(tǒng)相變墊相混淆。這些墊在每次變熱時(shí)便會(huì)熔化，而在冷卻時(shí)便會(huì)重新凝固。北極銀5所經(jīng)歷的粘度變化要細(xì)微得多，而且最終更有效。）

不導(dǎo)電：
北極銀5的配方可傳導(dǎo)熱量，而不是電力。
（雖然比導(dǎo)電的銀和銅潤(rùn)滑脂安全得多，但北極銀5應(yīng)當(dāng)遠(yuǎn)離電氣走線，引腳和引線。雖然不導(dǎo)電，但該化合物的電容很小，如果跨接兩個(gè)，則可能會(huì)引起問題。近距離電氣路徑。）

絕對(duì)穩(wěn)定性：
北極白銀5不會(huì)分離，運(yùn)行，遷移或流血。

符合： 符合RoHS2。

規(guī)格：

平均粒徑：
<0.49微米<0.000020英寸

擴(kuò)展的溫度限制：
峰值：–50°C至> 180°C
長(zhǎng)期：–50°C至130°C

性能：
當(dāng)使用以下方法進(jìn)行測(cè)量時(shí)，其CPU滿載內(nèi)核溫度比標(biāo)準(zhǔn)導(dǎo)熱膠或?qū)釅|低3至12攝氏度嵌入在CPU內(nèi)核中的經(jīng)過校準(zhǔn)的熱敏二極管。

覆蓋區(qū)域：
一個(gè)3.5克的注射器包含足夠的化合物，可以覆蓋至少15到25個(gè)小型CPU內(nèi)核，6到10個(gè)大型CPU內(nèi)核或2到5個(gè)加熱板。3.5克注射器的厚度為0.003英寸，將覆蓋大約16平方英寸。

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